2015-12-23 Silicon PIN Photodiode Version 1.3 SFH 213 FA Features: • Wavelength range (S ) 750 nm to 1100 nm 10% • Short switching time (typ. 5 ns) • 5 mm LED plastic package Applications • High speed photointerrupters • Industrial electronics • For control and drive circuits Ordering Information Type: Photocurrent Ordering Code I [µA] P V = 5 V, λ = 870 nm, E = 1 R e mW/cm2 SFH 213 FA 90 (≥ 65) Q62702P1671 2015-12-23 1

Version 1.3 SFH 213 FA Maximum Ratings (T = 25 °C) A Parameter Symbol Values Unit Operating and storage temperature range T ; T -40 ... 100 °C op stg Reverse voltage V 20 V R Reverse voltage V 50 V R (t < 2 min) Total Power dissipation P 150 mW tot ESD withstand voltage V 2000 V ESD (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) Characteristics (T = 25 °C) A Parameter Symbol Values Unit Photocurrent (typ (min)) I 90 (≥ 65) µA P (V = 5 V, λ = 870 nm, E = 1 mW/cm2) R e Wavelength of max. sensitivity (typ) λ 900 nm S max Spectral range of sensitivity (typ) λ (typ) 750 nm 10% ... 1100 Radiant sensitive area (typ) A 1.00 mm2 Dimensions of radiant sensitive area (typ) L x W 1 x 1 mm x mm Half angle (typ) ϕ ± 10 ° Dark current (typ (max)) I 1 (≤ 5) nA R (V = 20 V) R Spectral sensitivity of the chip (typ) S 0.65 A / W λ typ (λ = 870 nm) Quantum yield of the chip (typ) η 0.93 Electro (λ = 870 nm) ns /Photon Open-circuit voltage (typ (min)) V 380 (≥ 300) mV O (E = 0.5 mW/cm2, λ = 870 nm) e Short-circuit current (typ) I 42 µA SC (E = 0.5 mW/cm2, λ = 870 nm) e Rise and fall time (typ) t, t 0.005 µs r f (V = 20 V, R = 50 Ω, λ = 850 nm) R L Forward voltage (typ) V 1.3 V F (I = 100 mA, E = 0) F Capacitance (typ) C 11 pF 0 (V = 0 V, f = 1 MHz, E = 0) R Temperature coefficient of V (typ) TC -2.6 mV / K O V 2015-12-23 2

Version 1.3 SFH 213 FA Parameter Symbol Values Unit Temperature coefficient of I (typ) TC 0.1 % / K SC I (λ = 870 nm) Noise equivalent power (typ) NEP 0.028 pW / (V = 20 V, λ = 870 nm) Hz½ R Detection limit (typ) D* 3.6e12 cm x (V = 20 V, λ = 870 nm) Hz½ / W R Relative Spectral Sensitivity 1) page 8 Photocurrent / Open-Circuit Voltage 1) page 8 100 OHF01773 IP (VR = 5 V) / VO = f(Ee) Srel % 80 60 40 20 0 400 600 800 1000 nm 1200 λ 2015-12-23 3

Version 1.3 SFH 213 FA Power Consumption Dark Current 1) page 8 P = f(T ) I = f(V ), E = 0 tot A R R OHF00394 160 mW P tot 140 120 100 80 60 40 20 0 0 20 40 60 80 ˚C 100 T A Capacitance 1) page 8 Dark Current 1) page 8 C = f(V ), f = 1 MHz, E = 0 I = f(T ), V = 20 V, E = 0 R R A R 2015-12-23 4

Version 1.3 SFH 213 FA Directional Characteristics 1) page 8 S = f(ϕ) rel Package Outline 9.0 (0.354) 8.2 (0.323) 7.8 (0.307) 7.5 (0.295) Area not flat 0.6 (0.024) 1) 9) 5.9 (0.232) 1) 0) 20 18 0.4 (0.016) 0.03 0.02 1 (0. 8 (0. 5.5 (0.217) 100)ng 0.8 ( 0.5 ( ø5. ø4. 0.ci 4 (pa 5s 2. 1.8 (0.071) 5.7 (0.224) 0.6 (0.024) 1.2 (0.047) 5.1 (0.201) 0.4 (0.016) 29 (1.142) Chip position 27 (1.063) Cathode (Diode) Collector (Transistor) GEXY6260 Dimensions in mm (inch). Package 5mm Radial (T 1 ¾), Epoxy 2015-12-23 5

Version 1.3 SFH 213 FA Approximate Weight: 0.4 g Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm. Note: pad 1: anode 2015-12-23 6

Version 1.3 SFH 213 FA TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C Continuous line: typical process First wave Second wave Dotted line: process limits ∆T< 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C ca. 5 K/s 120 ˚C Typical 100 100 ˚C 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2015-12-23 7

Version 1.3 SFH 213 FA Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2015-12-23 8

Version 1.3 SFH 213 FA Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2015-12-23 9